Case Study
An American fabless semiconductor firm sought to implement a System on Chip (SoC) physical design using TSMC’s advanced 5nm process technology. The project aimed to enhance the performance and efficiency of their multi-million gate designs, integrating various analog IPs and achieving high-frequency operation.
The scope of work included physical design implementation at both block and SoC levels. Key tasks involved:
- Full chip floor planning
- SoC-level timing analysis
Key Challenges
- Constraint Issues that needed to be analyzing and debugged.
- Power Domains with multiple voltages to create and manage.
- Flow Analysis and comparison of different design flows.
- Cross-Clock Timing analysis and implementing necessary fixes.
Signoff Closure for timing and physical design to validate design’s readiness for manufacturing
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Talk To ExpertsThe Solution
- SoC Floorplan and Partitioning strategy to optimize the layout and manage the complexity of the design.
- Timing Analysis on full chip to ensure performance targets were met.
- EM/IR Analysis performed at both SoC and IP levels to ensure reliability, using advanced analysis tools.
- Block-Level Implementation managed from netlist to GDSII, ensuring seamless integration of all components, and successful signoff
- Iterative Testing approach to testing and validation to catch and resolve issues early, with close collaboration between design and verification teams to ensure alignment and efficiency.
Benefits
Enhanced Performance
High-frequency operation, and
integrated multiple analog IPs, enhancing overall SoC
performance.
Robust & Reliable
Robust design with thorough EM/IR analysis and multi-domain
power management.
Faster Time to Market
Streamlined design process
through effective planning & advanced analysis, reducing TTM
Scalability
Developed scalable design framework that can be adapted for
future projects and technologies.
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